Home
|
Products
|
9789356962026

Materials Characterization Series Characterization of Integrated Circuit Packaging Materials | Hardcover
by Moore
Highlights
9781606501870
ISBN:
Moore
Author:
274
Pages:
567 gm
Weight:
English
Language:
2010
Year:
N/A
Edition:
Hardcover
Binding:
₹7461
₹9326
With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems.
Online store of medical books
Discover a comprehensive range of medical books at our online store. From anatomy and physiology to the latest clinical guidelines, we've got you covered.
Trusted by students, educators, and healthcare professionals worldwide. Browse top publishers and expert-authored titles in every medical specialty. Enjoy fast shipping, secure payments, and easy returns. Your one-stop destination for quality medical knowledge at your fingertips.
Whether you're preparing for exams or expanding your clinical expertise, our curated collection ensures you have the right resources at hand. Dive into detailed illustrations, case studies, and up-to-date research that enhance your understanding and practical skills.
We regularly update our inventory to include the latest editions and newly released titles, helping you stay current in the ever-evolving medical field. Our advanced search and filtering tools make finding the perfect book quick and hassle-free.
Join our community of lifelong learners and medical enthusiasts. Sign up for exclusive discounts, early access to new arrivals, and personalized book recommendations tailored to your professional interests.