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Image of - Adhesive Bonding In Photonics Assembly And Packaging | Hardcover
Adhesive Bonding In Photonics Assembly And Packaging | Hardcover

Adhesive Bonding In Photonics Assembly And Packaging | Hardcover

by Yacobi B.G.

Yacobi (U. of Toronto) and Hubert (Exfor Photonic Solutions, Canada) have expanded a review published in the Journal of Applied Physics on a subject crucial to a wide variety of applications in microelectronics and photonics assemblies and packaging and to the manufacturing of optoelectronic and fiber-optic components, and of medical devices. Photocuring of adhesives offers advantages related to its capabilities for instant cure, cure-on-demand, increased production speed, and ease of automation; but its use requires understanding of adhesion, optical, thermal, mechanical, and chemical properties. After an introductory chapter, material is arranged in sections on photonics components, assemblies, and devices; fundamentals of bonding; types of adhesives; photopolymerization techniques; applications in photonics; issues related to optical adhesive bonding; and future directions. Annotation (c) Book News, Inc., Portland, OR (booknews.com)

Highlights

  • binding-icon

    9781588830197

    ISBN

  • binding-icon

    Yacobi B.G.

    Author

  • binding-icon

    250

    Pages

  • binding-icon

    1050 gm

    Weight

  • langauage-icon

    English

    Language

  • date-icon

    2003

    Year

  • edition-icon

    N/A

    Edition

  • binding-icon

    Hardcover

    Binding

₹19182

₹21314

Yacobi (U. of Toronto) and Hubert (Exfor Photonic Solutions, Canada) have expanded a review published in the Journal of Applied Physics on a subject crucial to a wide variety of applications in microelectronics and photonics assemblies and packaging and to the manufacturing of optoelectronic and fiber-optic components, and of medical devices. Photocuring of adhesives offers advantages related to its capabilities for instant cure, cure-on-demand, increased production speed, and ease of automation; but its use requires understanding of adhesion, optical, thermal, mechanical, and chemical properties. After an introductory chapter, material is arranged in sections on photonics components, assemblies, and devices; fundamentals of bonding; types of adhesives; photopolymerization techniques; applications in photonics; issues related to optical adhesive bonding; and future directions. Annotation (c) Book News, Inc., Portland, OR (booknews.com)

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